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Nikkei: US Moves Aircraft Carriers, Planes Closer to Taiwan Amid Reports of Pelosi’s Visit to Island_我的网站

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A |     (来自:SEMI)在周二的《200mm Fab Outlook to 2025》半导体行业展望报告中,SEMI 指出汽车和其它应用需求的激增,正在推动功率半导体和 MEMS 的产能扩张。    The US military hardware, including aircraft carriers and large aircraft, have been moved closer to Taiwan, amid House Speaker Nancy Pelosi’s current tour of the Indo­­-Pacific region and reports about her possible trip to the island, according to the news outlet Nikkei Asia.,The information comes after the China Times quoted unnamed sources as saying that Pelosi may arrive in Taiwan on August 2 and meet with the island's leader, Tsai Ing-wen, the next day.,The sources claimed that the House Speaker is also expected to hold a meeting with other high-ranking officials, possibly in Taiwan, and leave the island on Wednesday. The Taiwanese Foreign Ministry has not yet commented on the report.,China Warns Military Won't 'Sit Idly By' If Pelosi Lands in Taiwan10:04 GMT,This followed the House speaker embarking last week on a trip to the Indo-Pacific, which includes visits to Japan, Malaysia, Singapore and South Korea. Pelosi did not specify whether Taiwan is on her schedule, amid escalating tensions between China and the US.,In a separate development last week, China's People's Liberation Army (PLA) kicked off military drills, conducting a firing exercise in the southeastern province of Fujian across the strait from Taiwan and closing the designated maritime area.,Earlier, Beijing issued several warnings, saying that Washington would “bear the consequences” if Pelosi visits Taiwan, something that Chinese authorities say would violate the “One China Policy”.,Chinese President Xi Jinping, for his part, warned US counterpart Joe Biden against “playing with fire” over Taiwan during a telephone call on 28 July.,As part of the “One China Policy”, Beijing opposes all forms of official contact between foreign governments and Taiwan, which is seen by Chinese authorities as an essential part of the country.。包括 ASMC、比亚迪半导体、华润微电子、富基电子、英飞凌科技、安世半导体、意法半导体在内的芯片制造商,均已宣布投建 200mm 新晶圆厂、以满足不断增长的市场需求。此外汽车与功率半导体的晶圆厂产能,从 2021 到 2025 年的增长率高达 58%,其次是 MEMS(21%)、代工(20%)和模拟(14%)。

B | 从区域来看,中国将在 200mm 晶圆产能扩张方面引领全球,预计到 2025 年增长 66%。

C | 其次是东南亚(35%)、美洲(11%)、欧洲和中东(8%)、以及韩国(2%)。如果只预估到 2022 年底,中国大陆地区预计也可占据全球 200mm 晶圆厂产能的 21%(中国台湾地区为 11%),然后是日本(10%)。【背景资料】SIMI《2025 全球 200mm 晶圆厂展望报告》追踪了 330 多家工厂和产线,反映了 53 处设施和产线的 75 项更新,包括自上一份报告(2022 年 4 月)以来的四个新项目。

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Published on:04:56:08


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